| 1. | Test method for plane - strain fracture toughness and strain energy release rate of plastic materials
塑料平面应变裂缝强度和应变能量释放速率测试方法 |
| 2. | Standard test methods for plane - strain fracture toughness and strain energy release rate of plastic materials
塑料材料平面应变断裂韧性和应变能量释放率的标准试验方法 |
| 3. | The stress intensity factor ( sif ) and the strain energy release rate were simulated with different pre - crack length for the cases with no - flow underfill and with capillary - flow underfill
本文第六章用断裂力学方涪和有限元模拟分析了填充不流动胶芯片断裂问题，计算了芯片的应力强度因于k和能量释放率g 。 |
| 4. | The " popcorn " fracture analysis was studied by introducing reasonable simplifications and taking advantage of the strain energy release rate expression involving the hydrothermal effect
利用本文提出的断裂判据，通过合理简化，作者对吸湿电子元件在高温焊接过程中发生的“爆米花”式脱层断裂进行了研究分析。 |
| 5. | According to the result of analysis , it is advisable to invoke the general evaporation model should the avoidance of the overestimation on the strain energy release rate for very thin package cases be desired
此外，计算结果还显示：影响“爆米花”式断裂的主要可控因素是扩散系数d 。和蒸发系数f卜其中，蒸发系数f 。 |
| 6. | A new method for calculating the strain energy release rate of delamination crack propagation at an interface between dissimlar materials was suggested by using the j - integral with a small flat rectangular contour near the crack tip
提出了一种通过特定的扁平小矩形路径j积分，计算电子封装中异质界面分层裂缝扩展能量释放率的新方法。 |
| 7. | The strain energy release rates g near crack tip under different conditions were calculated by employing three methods of the fracture mechanics ( j - integral , straightforward method and crack tip opening displacement method )
并在有限元模拟中采用三种不同的断裂力学方法(裂缝顶端开口位移方法、直接方法、 j积分方法)计算了焊点断裂与否时的能量释放率g 。 |
| 8. | Two models for dynamic damage evolution of materials in general anisotropic damage state were presented ; the first one was based on power function of the effective equivalent stress and the second on the damage strain energy release rate
研究了工程材料在动力载荷下损伤演化的计算模型，提出了一般材料在各向异性损伤状态下的两种动力损伤模型。第一种以有效应力的等效值的幂函数为基础，第二种以损伤应变能释放率为基础。 |
| 9. | Because the calculation of j - integral is much simpler than other method , and the multilayers and interfaces are ubiquitous in microelectronic packaging structures , it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging , especially
并通过实例证明，此新方法对于界面分层问题是可行的。由于j积分计算十分简便，因此扁平小矩形路径j积分方法有望在电子封装分层能量释放率计算中得到广泛的应用。 |
| 10. | Abstract : by means o labrotary test on local grooving methof for the angle circular steel members , the relation among the distant btwween slots , their depth , and strain energy release rate is pointed out . the change regulation of mechanical properties of those membres is also studied . moreover , field application of this local grooving method convinces its applibility
文摘:通过对圆钢、角钢构件采用局部开槽法的室内试验研究，得出圆钢和角钢在进行应变释放时开槽的槽距、槽深及应变释放率之间的关系以及释放应变的计算公式，并对构件开槽后力学性能的变化规律进行初步试验研究，通过具体工程的现场应用，说明开槽法具有较好的现场适用性。 |
